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Job description
Apply deep electronics quality and inspection expertise to an advanced electronics assembly project that also supports the development of next-generation AI systems. This remote contract role focuses on PCB manufacturability, assembly inspection, defect analysis, counterfeit component detection, and semiconductor package evaluation. Prior AI experience is not required, as the work relies on established electronics engineering and quality expertise.
Key Responsibilities Review PCB CAM and Gerber files for manufacturability, quality, and compliance with applicable industry standards.
Perform IPC-A-610 and IPC/WHMA-A-620 visual inspections and provide detailed feedback on PCB assemblies and wire harness builds.
Analyze and document surface mount technology, SMT, and automated optical inspection, AOI, defects.
Identify AOI false calls, investigate root causes, and provide findings that support corrective action.
Apply AS6081-based counterfeit electronic component detection practices and provide actionable risk-mitigation insights.
Conduct and interpret semiconductor package inspections using C-SAM and X-ray imaging.
Evaluate die-level inspection findings and perform compliance checks involving MIL-STD-883 procedures.
Prepare concise written reports and clearly communicate findings to technical and non-technical stakeholders.
Work with project leads to improve workflows and strengthen technical training datasets used in AI development.
Contribute real-world electronics quality knowledge that helps AI systems improve how they learn, reason, and perform.
Qualifications 8 or more years of hands-on experience in electronics quality, CAM engineering, or failure analysis, particularly within PCB assembly, wire harness, or semiconductor packaging environments.
Extensive knowledge of IPC-A-610 and IPC/WHMA-A-620 inspection criteria.
IPC CIS or CIT certification is strongly preferred.
Demonstrated experience reviewing Gerber data and using PCB CAM software for manufacturability and quality assurance.
Proficiency with SMT processes, AOI defect analysis, and remediation of false calls in automated inspection systems.
Direct experience screening counterfeit electronic components in accordance with AS6081, including knowledge of risk indicators and mitigation strategies.
Hands-on experience with semiconductor inspection technologies such as C-SAM and X-ray imaging.
Familiarity with MIL-STD-883 procedures.
Strong written and verbal communication skills, including the ability to document findings clearly and transfer technical knowledge effectively.
Work Terms Remote contract engagement.
US-based candidates are preferred.
No prior AI experience is required.
Compensation Compensation ranges from $70 to $120 per hour.
Application Process Candidates apply through the online application process and must acknowledge the applicable candidate terms and privacy policy as part of submission.
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.