About this opportunity
Amazon Inc. lists this Senior IC Package Layout Engineer - 2.5D/3D-IC opportunity in tempe, Arizona. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Annapurna Labs, within AWS, is seeking a Package Layout Design Engineer to design advanced IC packages for ML and data center ASICs. You will drive layout tasks from floor planning through tape-out, collaborating with senior engineers, SI/PI, thermal, and manufacturing teams to meet performance and reliability goals.
Experience with 2.5D/3D packaging, RDL/substrate routing, and DFM/DRC is essential. Strong communication and tooling skills (Cadence APD/SiP, Synopsys IC Packaging, Mentor
#J-18808-Ljbffr
Worksite address
tempe, AZ, 85285, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.