About this opportunity
Apple Inc. lists this Senior IC Package & Module Integration Engineer opportunity in san francisco, California. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Apple Inc. in the San Francisco Bay Area is seeking a senior IC packaging engineer to develop advanced packaging solutions for consumer products.
You will interface with design, quality, supply chain and external suppliers to push new packaging technologies from concept to production. The role requires a BS with 10+ years in IC packaging, and preferred MS/PhD in mechanical engineering, physics or materials science.
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Worksite address
san francisco, CA, 94199, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.