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Ensurge Inc.

Senior Manufacturing Engineer – Thin Film Engineering (PVD, PECVD, ALD & RIE)

san jose, CA

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About this opportunity

Ensurge Inc. lists this Senior Manufacturing Engineer – Thin Film Engineering (PVD, PECVD, ALD & RIE) opportunity in san jose, California. Review the employer’s description below for duties, qualifications and application requirements.

Job description

About Ensurge Micropower

Ensurge Micropower (OSE: ENSU) is a pioneer in solid-state microbattery technology, enabling the next generation of intelligent, connected devices. Leveraging proprietary thin-film and roll-to-roll manufacturing, Ensurge delivers safe, high-energy-density batteries for wearables, health tech, industrial sensing, and defense applications. As our technology transitions from development to production, disciplined manufacturing execution becomes the differentiator.

Role Overview

Ensurge is seeking a Senior Manufacturing Engineer (IC) to own and scale the Thin-Film Engineering processes — deposition (PVD/Sputtering, PECVD, ALD) and etch (RIE) — from pilot through early production. This role is not just about process — it is about delivering manufacturing results.

Responsibilities

Own daily manufacturing performance for the PVD/Sputtering, PECVD, ALD, and RIE process areas

Drive output, yield, uptime, and cycle time

Support production directly — troubleshooting issues in real time

Partner with Operations to ensure line execution meets plan

Convert R&D processes into repeatable, production-ready workflows

Define and lock critical process parameters (CPPs) — e.g., chamber pressure, Ar/process gas flow, RF/DC power, substrate bias, deposition rate, film stress and thickness uniformity targets (PVD/PECVD); precursor/co-reactant pulse and purge times, cycle count, growth per cycle (GPC), and substrate temperature (ALD); RF power, gas chemistry (e.g., CF4/O2/Cl2), etch rate, selectivity, sidewall profile/anisotropy, DC bias, and endpoint detection (RIE)

Define and lock control limits and OCAPs

Ensure processes are robust, stable, and scalable

Work with Equipment Engineering to define tool requirements (sputter cathodes/targets, PECVD chambers, ALD reactors and precursor delivery systems, RIE/ICP-RIE chambers and endpoint detection systems, RF/DC power supplies, vacuum, gas delivery, and abatement/scrubber systems)

Improve reliability and uptime

Implement process-driven upgrades

Lead tool qualification and process acceptance

Ensure equipment supports throughput, precision, and repeatability

Own flow from substrate input to deposition/etch to downstream handoff to assembly

Reduce bottlenecks, WIP, and inefficiencies

Improve line balance and production scheduling alignment

Support layout and flow improvements as the system scales

Partner with Quality to implement SPC and process control on film thickness, stress, uniformity, and conformality

Film characterization (ellipsometry, profilometry, XRD, SEM/AFM, four-point probe) to validate deposition results against CPPs

Traceability and data capture

Build and maintain SOPs, process specs, control plans, and ensure manufacturing is data-driven and auditable

Lead structured RCA on yield loss, defects, downtime; use characterization data (SEM, XRD, cross-section imaging) to root-cause excursions

Implement sustainable fixes — not workarounds

Drive continuous improvement aligned to operational excellence principles (standardwork, DMS, etc.)

Qualifications

7–12+ years in manufacturing engineering with thin-film deposition and etch (PVD/sputtering, PECVD, ALD and/or RIE) in battery, semiconductor, or thin-film industries

Proven experience owning manufacturing processes on the floor

Strong track record of driving yield and throughput improvements

Experience supporting or leading pilot → production scale-up

Hands‑on mindset — comfortable working directly with equipment, technicians, and operators

Working knowledge of thin‑film characterization techniques (e.g., ellipsometry, profilometry, XRD, SEM) and their use in validating and controlling deposition processes

Understanding of film stress engineering, plasma physics, RF coupling, and DC self‑bias

Understanding of plasma etch chemistry, selectivity, anisotropy, and endpoint detection (RIE/ICP‑RIE)

Familiarity with ALD precursor chemistry, self‑limiting surface reactions, and pulse/purge sequencing

Vacuum systems and chamber conditioning experience

Experience with image‑based film/defect characterization (SEM, optical microscopy) and correlating characterization data back to process control limits

Experience with MES, traceability systems, or data‑driven manufacturing

Salary Range

$162,000-$198,000

The base salary range is specific to California. The salary of the final candidate selected for this role will be determined by a variety of factors, including, but not limited to, internal equity, experience, education, specialty, and training.

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Worksite address

san jose, CA, 95199, US

Who can apply

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