About this opportunity
Micron Technology lists this Senior Mechanical & Thermal Lead for AI-Compute Hardware opportunity in boise, Idaho. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Micron Technology, a world leader in memory and storage solutions, seeks a seasoned Mechanical & Thermal Engineer to shape the mechanical and thermal architecture of next‑gen hardware platforms. Bring 7+ years of experience in electronics/semiconductor environments and lead cross‑functional teams to deliver heat‑mitigated, reliable products through concept to high‑volume manufacturing.
You will perform thermal CFD/FEA analyses, develop cooling strategies, and drive validation plans across
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Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.