About this opportunity
Boeing lists this Senior Microelectronics Packaging Technical Lead opportunity in pleasanton, California. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Boeing is seeking a Microelectronic Packaging Technical Lead Project Engineer to join the Secure Computing Solutions team, focusing on the development of cutting-edge cyber, ARM-based SoC solutions for the Boeing Defense, Space & Security business.
You will be part of a collaborative, multi-disciplinary team delivering packaging solutions, including 3D advanced packaging, with strong emphasis on schedule, risk management, and cross-functional coordination across design, testing and supplier
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Worksite address
pleasanton, CA, 94566, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.