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Microsoft

Senior Multi-Layer PCB Designer for High-Density Boards

redmond, WA

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About this opportunity

Microsoft lists this Senior Multi-Layer PCB Designer for High-Density Boards opportunity in redmond, Washington. Review the employer’s description below for duties, qualifications and application requirements.

Job description

Microsoft in Redmond seeks an experienced PCB Design Engineer to own complex PCB layouts from requirements through release, including placement, routing, stack-up, impedance, and DFM. You will collaborate with electrical, mechanical, and manufacturing teams to translate schematics into manufacturable boards and drive robust release packages.

Ideal candidates blend strong multi-layer PCB knowledge with signal integrity, impedance control, and high-density interconnect expertise, and can leverage

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Worksite address

redmond, WA, 98052, US

Who can apply

Review the original listing for work authorization, qualifications and employer requirements.

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