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LanceSoft, Inc.

Senior Packaging Engineer - Lead Packaging Innovations

stamford, CT

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About this opportunity

LanceSoft, Inc. lists this Senior Packaging Engineer - Lead Packaging Innovations opportunity in stamford, Connecticut. Review the employer’s description below for duties, qualifications and application requirements.

Job description

LanceSoft, Inc. is seeking a senior packaging engineer to manage packaging programs, act as a technical lead on project teams, and mentor co-ops and entry-level engineers.

The role emphasizes developing new packaging, setting standards, and ensuring safety, quality, and efficiency in packaging across various processes. The candidate will drive projects from conception to completion, collaborating with suppliers and internal partners, and proactively managing timelines and budgets to deliver

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Worksite address

stamford, CT, 06925, US

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Last received from source 2026-10-31

Source: WhatJobs

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