About this opportunity
Amazon Inc. lists this Senior Packaging & PCB Design Automation Engineer opportunity in omaha, Nebraska. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Annapurna Labs seeks a Senior Design Automation Engineer to join our hardware team and contribute to the physical design of advanced IC packages and PCBs for next‑gen ML and data center ASICs. You will develop automation to enable physical design teams from floor planning through tape‑out and manufacturing release.
You will work with senior engineers and cross‑functional groups to optimize die RDL, interposer and PCB layouts, evaluate EDA tools, and implement scripting in Python, Skill and TCL
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Worksite address
omaha, NE, 68197, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.