Availability awaiting confirmation
We are waiting for a fresh update from the source. This page preserves the last received job details; current availability is not confirmed.
Job description
OpenAI is seeking an Advanced Packaging Reliability Engineer in San Francisco to lead reliability for AI-grade packages. You will model thermo-mechanical behavior, assess failure mechanisms, and guide design and materials choices to improve lifetime and scalability of HPC systems.
You will partner with design, silicon, and manufacturing teams to predict performance, develop qualification strategies, and drive robust, production-ready packaging solutions for OpenAI’s supercomputing platform.
#J-18808-Ljbffr
Worksite address
san francisco, CA, 94199, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.