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Job description
ORCA Computing Ltd in Austin, TX, is seeking a Full-time Packaging Engineer to own the packaging strategy for photonic devices, including fiber attach, wire bonding, and RF/driver integration. The role collaborates with external vendors from development to volume production and ensures state-of-the-art fiber-PIC coupling from lab to deployed devices.
You will contribute to ultra-low-loss passive photonic components and EO modulators, develop scalable packaging processes, analyze data, and
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Worksite address
austin, TX, 78716, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.