About this opportunity
Micron Technology, Inc lists this Senior Process Engineering Technical Leader opportunity in boise, Idaho. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here!
This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost.
Responsibilities
Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs
Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs
Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions
Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs
Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness
Minimum Qualifications
Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field
13+ years of semiconductor R&D experience, including 10+ years in advanced packaging
Proven ability to lead multi‑team technical efforts and drive decisions without formal authority
Preferred Qualifications
Experience leading FOAK process or equipment development under technical uncertainty
Hands‑on work with equipment and materials suppliers shaping next‑generation capabilities
Demonstrated technical leadership through mentoring, methodology development, patents, or publications
Deep expertise in bonding processes such as solder reflow, TCB, and hybrid bonding
Strong understanding of process and package integration and cross‑module interactions
Benefits
Micron offers a choice of medical, dental and vision plans in all locations, enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays.
Equal Opportunity Employment
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.