About this opportunity
Amkor Technology, Inc. lists this Senior Product Manager, Flip-Chip Packaging & NPI opportunity in tempe, Arizona. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Amkor Technology, Inc. in Tempe, AZ, seeks a Product Engineer/Manager with experience in IC package development and business acumen, emphasizing fcCSP technologies across package types.
The role is based in the Tempe corporate office with a hybrid schedule. You will manage product development, business strategy, pricing/cost controls, NPI engineering, and customer negotiations from inception through qualification and production.
#J-18808-Ljbffr
Worksite address
tempe, AZ, 85285, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.