About this opportunity
NVIDIA Corporation lists this Senior Semiconductor Packaging Modeling Lead - Hybrid opportunity in santa clara, California. Review the employer’s description below for duties, qualifications and application requirements.
Job description
NVIDIA Corporation in Santa Clara, CA is seeking a Senior Package Modeling Engineer within the Advanced Technology Group (ATG). You will perform FEA to assess stress and thermo-mechanical behavior of advanced semiconductor packaging, contributing to roadmaps and material choices while mentoring teammates.
The role requires a strong background in FEA tools and packaging architectures, with excellent problem-solving and communication skills to drive reliable builds and collaborations across groups.
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Worksite address
santa clara, CA, 95053, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.