About this opportunity
TSMC - Taiwan Semiconductor Manufacturing Company Limited lists this Senior Substrate & 3DIC Packaging Engineer opportunity in san jose, California. Review the employer’s description below for duties, qualifications and application requirements.
Job description
A leading semiconductor foundry in San Jose seeks a highly skilled Substrate / Advanced Package Engineer to innovate in 3DIC design and packaging. Responsibilities include designing, simulating, and optimizing advanced packaging technologies while collaborating with cross-functional teams. Candidates should have a Master’s degree or Ph.D. in Engineering and over 15 years of relevant experience. The role promises significant impact within a cutting-edge environment focused on technological advancements.
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Worksite address
san jose, CA, 95199, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.