About this opportunity
Amazon Web Services (AWS) lists this Senior Thermal & Mechanical Packaging Engineer (Data Center) opportunity in austin, Texas. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Annapurna Labs (U.S.) Inc., part of Amazon Web Services, is seeking a Sr. Thermal & Mechanical Packaging Engineer in Austin, TX.
You will design and build packaging systems for the world's largest computing infrastructure, from circuit-level concepts to high-volume manufacturing. You will optimize thermal and mechanical solutions to meet performance, cost, and reliability targets, work with cross-functional teams, and validate designs with CFD/FEA tools and lab experiments.
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Worksite address
austin, TX, 78716, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.