About this opportunity
Micron Technology, Inc lists this Senior Wafer Bonding Process Engineer - AI-Driven opportunity in boise, Idaho. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Micron Technology, Inc. in Boise, Idaho is seeking a Staff/Principal Wafer Bond Process Development Engineer to lead development and optimization of wafer bonding technologies for advanced DRAM.
You will plan experiments (DOEs), drive yield improvements, and collaborate across functions to deliver high-quality, cost-efficient solutions. The role emphasizes data-driven decision making and the use of AI/ML/LLM tools to accelerate innovation and maintain production readiness.
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Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.