About this opportunity
1000 Micron Technology, Inc. lists this Senior Wafer Bonding Process Engineer opportunity in boise, Idaho. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Micron Technology, Inc. in Boise, Idaho seeks a Staff/Principal Wafer Bonding Process Engineer to lead next‑gen DRAM bonding processes. You will plan experiments, improve yield, reduce costs, and drive productivity using data‑driven, AI‑assisted approaches.
You will evaluate new equipment and materials, mentor teams, and collaborate across multiple functions to ensure manufacturing readiness and quality at scale.
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Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.