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Job description
This company is one of the most influential names in AI infrastructure, building the compute, networking and interconnect technology behind some of the largest AI clusters in the world. As AI systems scale, moving data efficiently has become as critical as processing it, and the company is investing heavily in silicon photonics and co-packaged optics to replace power-hungry electrical links with integrated optical engines inside next-generation switching platforms. This team sits at the centre of that roadmap, with the backing, supply chain partnerships and manufacturing scale to take photonic technology from the lab to hyperscale deployment.
About the role
This is a hands‑on engineering role based in the San Francisco Bay Area for a photonics specialist who wants their work shipping in production AI hardware, not sitting in a research paper. You'll design, simulate, characterise and bring up silicon photonic devices and circuits for co-packaged optical engines used in high-bandwidth data centre networking. Working alongside packaging, electrical, laser and systems teams, you'll help turn photonic designs into high-volume products that directly shape how the world's largest AI systems are built.
Key responsibilities
Design and simulate silicon photonic components including modulators, photodetectors, waveguides and couplers
Develop photonic integrated circuits for co-packaged optics and high-speed optical interconnect
Run optical and electro-optical characterisation of devices and PICs at wafer and die level
Work with foundry partners on PDKs, process variation and tape-out readiness
Partner with packaging teams on fiber attach, laser integration and optical coupling
Collaborate with electrical, SerDes and systems teams on link budgets and performance targets
Analyse test data to drive design iterations, yield improvements and production readiness
Contribute to architecture decisions for next-generation optical engines
Ideal profile
5+ years working in silicon photonics or integrated photonics in industry
Hands‑on experience designing PIC components such as ring or Mach‑Zehnder modulators, germanium photodetectors, and grating or edge couplers
Proficiency with photonic simulation tools such as Lumerical, FDTD or eigenmode solvers
Experience taking designs through tape‑out with a silicon photonics foundry
Lab experience with optical test equipment and high‑speed characterisation
Understanding of high‑speed optical links, PAM4 signalling and link budgets
Strong data analysis skills using Python or MATLAB
MS or PhD in Electrical Engineering, Physics, Optics or a related field
Preferred qualifications
Experience with co‑packaged optics or optical I/O
Experience with 200G per lane or higher data rates
Knowledge of laser integration or III‑V heterogeneous integration
Exposure to thin‑film lithium niobate or silicon nitride platforms
Experience with photonic layout tools and automated wafer‑level testing
Background supporting products through volume manufacturing
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Worksite address
san francisco, CA, 94199, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.