About this opportunity
Micron lists this Staff Engineer, Advanced Packaging: Wafer Edge Trim & Backgrind opportunity in boise, Idaho. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Micron Technology seeks an experienced R&D engineer to advance wafer edge trim, backgrind and thinning processes for next-gen memory products. You will collaborate with process integration and adjacent areas to meet performance and yield targets, while solving complex mechanical and material challenges.
The role emphasizes experimental design (DOE), data analysis, and scalable solutions with strong ownership and independent work ability.
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Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.