About this opportunity
Renesas Electronics Corporation lists this Staff Package Design Engineer: Multi-Chip & Power Modules opportunity in tempe, Arizona. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Renesas Electronics Corporation in Tempe, AZ (or Austin, TX) seeks a Staff Package Design Engineer to advance high-performance semiconductor package solutions including power modules, FCBGA, SiP, WLCSP, and multi-die architectures. You will collaborate with silicon design, SI/PI, thermal, reliability, and manufacturing teams to ensure robust, manufacturable designs.
The role emphasizes package layout execution, DFM/DFA adherence, and cross-domain co-design across global engineering teams to
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Worksite address
tempe, AZ, 85285, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.