About this opportunity
Micron Technology, Inc lists this Staff / Principal Wafer Bond Process Development Engineer opportunity in boise, Idaho. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Req ID:
JR Staff / Principal Wafer Bond Process Development Engineer
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
In your role as a Staff / Principal Wafer Bonding Process Engineer within Micron Technology's DRAM Technology Development group, you will join a worldwide memory development organization. You will contribute to developing modern wafer bonding process technology that keeps Micron at the forefront of memory technology. This position is important because it directly affects product quality, reliability, yield, cost savings, efficiency, and risk control. You will initiate, develop, and fine-tune bonding processes while addressing manufacturing line challenges. You will also manage process, equipment, and material evaluations and improvements to apply changes at various process steps. Your duties include leading and engaging in activities to improve yield and reduce costs, overseeing new process baseline qualifications, and collaborating with suppliers to achieve quality, cost, and risk objectives. You will use AI/ML/LLM tools to boost efficiency and maintain flawless operations.
Responsibilities
Develop and optimize wafer bonding processes to enable next-generation DRAM technologies.
Plan and execute experiments (DOEs) to improve process performance, product quality, and reliability.
Drive yield improvement, cost reduction, and productivity initiatives using data-driven problem solving.
Evaluate and qualify new equipment, materials, and process technologies for development and manufacturing.
Collaborate with manufacturing, suppliers, and cross-functional teams to resolve issues and implement process improvements.
Use advanced analytics, AI/ML tools, and technical expertise to solve complex problems and accelerate innovation.
Minimum Requirements
PhD with 3+ years, Master's degree with 5+ years, or Bachelor's degree with 7+ years of relevant semiconductor industry experience.
5+ years of experience developing and driving wafer bonding technologies, process integration, or related semiconductor manufacturing processes.
Hands-on experience with one or more of the following: direct bonding, hybrid bonding, wafer thinning, de-bonding, or other advanced bonding technologies.
Strong analytical and problem-solving skills with a demonstrated ability to lead complex technical challenges, drive innovation, and deliver process improvements through data-driven decisions.
Proven ability to work effectively across cross-functional teams while independently leading projects, influencing technical direction, and delivering results.
Experience developing and optimizing semiconductor processes to improve quality, reliability, yield, cost, and manufacturing readiness.
Preferred Requirements
Experience supporting DRAM, memory, or advanced semiconductor technology development.
Knowledge of process characterization, statistical analysis, DOE methodology, and root-cause investigation techniques.
Experience qualifying new equipment, materials, and process technologies for high-volume manufacturing.
Familiarity with supplier collaboration and technology transfer activities.
Experience using AI, machine learning, or large language models (LLMs) to improve engineering productivity and accelerate problem solving.
Strong written, verbal, and presentation communication skills.
Location
Boise, Idaho
Micron benefits include: Health, Savings, Wellbeing Programs, Stock Purchase Discount, and a generous Time Off Program.
Job Profile(s):
Semiconductor Process Engineer 4
Relocation Level: TBD
Before Getting Started
Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that:
Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.