About this opportunity
ISU Research Park lists this Technical Marketing Engineer: 2.5D/3DIC Packaging Solutions opportunity in ames, Iowa. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Siemens EDA is seeking a Technical Marketing Engineer Advanced IC Packaging to drive technical marketing and solution development for 2.5D/3DIC flows. You will connect planning, layout, and verification tools with Tcl and Python, engaging customers in technical discussions to define compelling use cases.
The role demands deep knowledge of Advanced IC Packaging, strong scripting skills, and the ability to translate customer needs into actionable development input.
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Worksite address
ames, IA, 50011, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.