About this opportunity
Amazon Inc. lists this Thermal & Mechanical Packaging Engineer - Data Center opportunity in austin, Texas. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Annapurna Labs in Amazon's data center division seeks a Sr. Thermal & Mechanical Packaging Engineer to lead the design and optimization of high-volume semiconductor packaging for our world-scale computing infrastructure.
You will develop from the lowest circuit levels to full system designs, applying CFD/FEA methods and collaborating with vendors and internal teams to improve performance, reliability, and cost across AWS deployments.
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Worksite address
austin, TX, 78716, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.