About this opportunity
intel lists this Advanced Packaging Development Engineer — Pathfinding & Impact opportunity in hillsboro, Oregon. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Intel Corporation, a global leader in semiconductor innovation, seeks a Process Integration Engineer for its Hillsboro, Oregon campus. You will drive advanced manufacturing processes, lead design and development for future device architectures, and partner with suppliers to enable cutting-edge technology across high-volume and next-gen nodes.
You will apply SPC/DOE principles, work with robotics and automation systems, and communicate complex ideas to diverse audiences, contributing to Intel's
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Worksite address
hillsboro, OR, 97104, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.