About this opportunity
Micron Technology, Inc. lists this Senior Advanced Packaging Process Leader opportunity in boise, Idaho. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Micron Technology, Inc. seeks a veteran organizational leader to guide and influence advanced packaging process development for memory products (HBM, 3DS DRAM, 3D architectures).
You will drive end-to-end technology execution, partner across functions, and shape internal roadmaps and external ecosystems. The role emphasizes data-driven decision-making, AI-enabled tooling, and collaboration with suppliers and R&D to accelerate learning and deliver high-impact solutions.
#J-18808-Ljbffr
Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.